

This is the best summary I could come up with:
TOKYO – Vice foreign ministers from Japan and China held a strategic dialogue Monday for the first time in four and a half years, as the countries focus on shared interests amid a host of diplomatic challenges.
Masataka Okano and Chinese counterpart Ma Zhaoxu discussed developments in the East and South China seas as well as Ukraine during their talk in Tokyo.
Other topics included Japan’s release of treated wastewater from the stricken Fukushima Daiichi nuclear power plant and the detention of Japanese nationals in China.
Japanese Foreign Minister Yoko Kamikawa and Chinese counterpart Wang Yi are considering holding talks on the sidelines of ASEAN-hosted meetings in Laos starting Thursday.
China is eager to bolster ties with Japan ahead of the U.S. presidential election in November, concerned that a harsher stance by Washington could lead Tokyo to follow suit.
Beijing also awaits the outcome of the leadership race in Japan’s ruling Liberal Democratic Party scheduled for next month, which will decide the country’s next prime minister.
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This is the best summary I could come up with:
In the biggest news of all, Rivian and Volkswagen announced a $5 billion joint venture that will co-develop core parts of the hardware and software platform to be used in cars from both automakers.
We love that because it aligns so beautifully with our mission: the ability to help accelerate putting highly compelling electric vehicles into the market, which will ultimately drive more demand.
A core objective of how we’ve structured the joint venture is that we don’t lose the velocity and the speed and the decisiveness and lack of bureaucracy that exists within our software function today.
Beyond just simplification of how we manage running over-the-air updates across so many different instances, it also gets us a lot of supply chain leverage in a way that we, Rivian, haven’t had in the past.
In fact, you can imagine the day of the announcement, I had a handful of phone calls from CEOs of big semiconductor suppliers, and they’re like, “Hey, we can work harder on pricing.” So, that was awesome.
So, taking away all those mechanical design studio packaging constraints that we had before, and then solving the biggest challenge, which was network architecture by this being that as a project, it’s just a very different type of relationship.
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